Sreabhadh próiseas tsubstráit alúmanaim

1. Oscailt

Próiseas táirgthe tsubstráit alúmanaim

1. An próiseas gearrtha ábhar - ghearradh

2. An cuspóir a oscailt

Gearr ábhair mhórmhéide isteach go dtí an méid atá riachtanach le haghaidh táirgeadh

3. Réamhchúraimí maidir le hábhair oscailte

① Check the size of the first piece after cutting

② Pay attention to the scratches on the aluminum surface and the scratches on the copper surface

③ Pay attention to the layering and draping of the edge of the board

2. Druileáil

1. Próiseas druileála

Bord Cigireachta Doweling - Drilling -

2. Cuspóir an druileála

Suíomh agus druileáil an pláta chun cuidiú leis an bpróiseas táirgthe ina dhiaidh sin agus le tionól custaiméirí

3. Réamhchúraimí le haghaidh druileála

① Check the number of drilled holes and the size of the holes

② Avoid scratches on the sheet

③ Check the drape of the aluminum surface and the deviation of the hole position

④ Check and replace the drill bit in time

⑤ Drilling is divided into two stages, one drilling: after cutting the material, the drilling is a peripheral tool hole

An dara druil: poll uirlis san aonad tar éis masc solder

3. Íomháú scannáin thirim/fhliuch

1. Próiseas íomháithe scannáin thirim/fliuch

Forbairt nochta - pláta meilte - scannán -

2. Aidhm íomháithe scannáin thirim/fhliuch

Tá na codanna is gá chun an ciorcad a dhéanamh rindreáilte ar an mbileog

3. Réamhchúraimí le haghaidh íomháithe scannáin thirim/fhliuch

① Check whether there is an open circuit in the circuit after developing

② Whether there is any deviation in the development alignment to prevent the occurrence of dry film breakage

③ Pay attention to the defective circuit caused by scratches on the board surface

④ There should be no air residue during exposure to prevent poor exposure

⑤ After exposure, keep it still for more than 15 minutes before developing

4. Eitseáil Aigéad/Alcaileach

1. Próiseas eitseála Aigéad/alcaileach

- á eitseáil ag baint - clár iniúchta - a thriomú

2. Cuspóir an eitseála aigéid/alcaileach

Tar éis an scannán tirim / fliuch a íomháú, coinnigh an chuid riachtanach den chiorcad, bain an barrachas lasmuigh den chuaird, agus tabhair aird ar chreimeadh an tsubstráit alúmanaim ag an tuaslagán eitseála le linn eitseála aigéad;

3. Réamhchúraimí maidir le heitseáil aigéadach/alcaileach

① Note that the etching is not clean and the etching is excessive

② Pay attention to line width and line thickness

③ The copper surface is not allowed to be oxidized or scratched

④ The dry film should be removed cleanly

Cúig, masc solder scáileán síoda, carachtair

1. Masc solder scáileán síoda, próiseas carachtar

Scáileán síoda - Réamh-bácáil - Forbairt Nochtadh - - Carachtair

2. An cuspóir masc solder scáileán síoda agus carachtair

① Anti-soldering: protect the circuit that does not need to be soldered and prevent the tin from entering and causing a short circuit

② Characters: play the role of marking

3. Nithe ​​ar gá aird a thabhairt orthu le haghaidh masc solder scáileáin síoda agus carachtair

① To check whether there is garbage or foreign matter on the board

Foshraith alúmanaim COB

Foshraith alúmanaim COB

② Check the cleanliness of the stencil ③ Pre-bake for more than 30 minutes after screen printing to avoid bubbles in the lines

④ Pay attention to the thickness and uniformity of the silk screen

⑤ After pre-baking, the board should be completely cooled to avoid sticking to the film or destroying the gloss of the ink surface.

⑥ Place the ink face down during development

6. V-CUT, bord gong

1. V-CUT, próiseas an chláir gong

V-CUT——Gong board——Tear off protective film——Remove Pifeng

2, V-Gearr, cuspóir an bhoird gong

① V-CUT: Connect a single PCS line to the whole PNL plate cutting and leave a small part for easy packaging and removal.

② gong board: remove the excess part of the circuit board

3. Réamhchúraimí le haghaidh V-CUT agus gong bord

① During the V-CUT process, pay attention to the size of V, incomplete edges and burrs

② Pay attention to burrs when the gong board is used, and the gong knife is skewed. Check and replace the gong knife in time.

③ Finally, avoid scratches on the board when removing the front.

Seacht, tástáil, OSP

1. Tástáil, próiseas OSP

Tástáil Líne - Seasamh Tástála Voltais - OSP

2. Tástáil, cuspóir OSP

① Line test: check whether the completed line is working normally

② Withstand voltage test: check whether the completed line can withstand the specified voltage environment

③ OSP: Make the circuit better for soldering

3, tástáil, réamhchúraimí OSP

① How to distinguish between qualified and unqualified products after testing

② Placement after finishing OSP

③ Avoid line damage

Ocht, FQC, FQA, pacáistiú, loingseoireacht

1. Próiseas

FQC - FQA - Pacáil - Loingsiú

2. Cuspóir

① FQC conducts full inspection and confirmation of the product

② FQA random inspection and verification

③ Pack and ship to customers as required

3. Tabhair aird

① FQC pays attention to the confirmation of appearance during the visual inspection process and makes a reasonable distinction

② FQA really conducts random inspections to verify the inspection standards of FQC

③ To confirm the number of packages, avoid mixed boards, wrong boards and package damage 3